Ni-Solder (Pb/Sn) Selective Wet-Etching Method in Acidic Solutions.

Wet and Dry Etching Theory

Wet anisotropic etching of polyimide

With the aim of developing flexible biocompatible implants for in vivo studies of nerve regeneration [1], fabrication of passive polyimide membranes using the commercial available Kapton film (100HN and 50HN, from DuPont) was investigated. Polyimide has been widely used in microelectronics, and its application possibilities have been widening to other fields such as micromachining and biomedica...

Mechanisms and solutions to the brittle solder joint in electroless Ni plating

Brittle solder joints in Electroless Ni electroless Pd immersion Au (ENEPIG) surface finishes are one of the key re­ liability issues in electronics assembly. Previous characterization of the reflow process has indicated that interfa­ cial voids formed after solder reflow are responsible for the decreases in solder joint strength. However, the mechanisms behind the formation of these voids in t...

Effects of solder volume on formation and redeposition of Au- containing intermetallics in Au/Ni-SnAgCu-Ni(P) solder joints

SnAgCu is one of the most promising candidates for lead-free solders to replace conventional eutectic SnPb solders. The effects of solder volume on interfacial reactions and microstructure evolution in Au/Ni-SnAgCu-Ni(P) solder joints have been investigated under soldering and thermal aging conditions. The results show that solder volume has a strong effect on the formation of Au-containing int...

Study of Selective Wet Etching of Titanium towards Copper in Hydrofluoric Free Etchant